IC Chip Solder Repair Station

       Automatic IC Chip Solder Repair Station

An Automatic IC Chip Solder Repair Station is a specialized tool used in electronics manufacturing for reworking

or repairing Integrated Circuit (IC) chips. It typically includes a variety of features and tools, such as a hot air or in-

frared heater for heating the component and board, reflow oven for reflowing the solder.

Model:DH-A2E

1.Product Features of Hot Air Automatic IC Chip Solder Repair Station

•High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.

• Convenient alignment.

•Three independent temperature heatings + PID self-setting adjusted, temperature  accuracy will be on ±1°C

•Built-in vacuum pump, pick up and place BGA chips.

•Automatic cooling functions.

2.Specification of Infrared Automatic IC Chip Solder Repair Station 

with Color vision

3.Details of Laser positioning Automatic IC Chip Solder Repair Station

4.Why Choose Our laser position Automatic IC Chip Solder Repair Station?

5.Certificate of Optical alignment Automatic IC Chip Solder Repair Station?

6. Packing list of Optics align Automatic IC Chip Solder Repair Station

7. Shipment of Automatic IC Chip Solder Repair Station

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe.  If you prefer other terms of 

shipment, please feel free to tell us.

8. Contact us for an instant reply and the best price.

Email: john@dh-kc.com

MOB/WhatsApp/Wechat:  +8615768114827

Click the link to add my WhatsApp:

https://api.whatsapp.com/send?phone=8615768114827

9.Related news about Automatic IC Chip Solder Repair Station

Zhongwei Semiconductor completed 3 rounds of inquiry

The Shanghai Stock Exchange (hereinafter referred to as “Shanghai Stock Exchange”) announced the 

three rounds of inquiry letters from China Micro-Semiconductor Equipment (Shanghai) Co., Ltd. (her-

einafter referred to as “Zhongwei Semiconductor”).

In this round of inquiries, the Shanghai Stock Exchange focused on the capital and financial situation 

of Zhongwei Semiconductor. It only raised three issues, namely, the development expenditure capit-

alization, inventory and production and sales, and government subsidies of Zhongwei Semiconductor.

The Shanghai Stock Exchange noted that the capitalization of development expenditure of China Mi

cro-Semiconductor has accumulated to 350 million yuan. Based on this, China Micro-Semiconductor

 is required to combine the process, key time, success probability and benchmarking time of the com-

parable company North China Huachuang (002371.SZ) to demonstrate the capitalization of China-

Micro Semiconductor R&D expenditure. Whether the point complies with the accounting standards.

According to the reply from the sponsor, Haitong Securities, the micro-semiconductor's R&D inves-

tment capitalization ratio in the past three years was 34.15%, and that in the North China Ventures 

was 45.39%. Haitong Securities believes that the proportion of capitalization of R&D investment in 

China Micro-Semiconductor is slightly lower than that of North China Ventures, and the capitalizat-

ion conditions are reasonable and accurate.

In this round of inquiries, Haitong Securities also listed the audit case for capitalization from the sec-

ond year of the reporting period – Mindray Medical (300760.SZ).

In terms of inventory and sales volume, the SSE requires the company to report the number of relat-

ed equipment that was sold in the current year during the reporting period and the sales situation in 

each year after the period and to provide risk warnings for matters related to the issuance of goods 

during the reporting period.

Haitong Securities believes that the equipment products of Zhongwei Semiconductor can be basically 

sold in the current year and the next year of production. There is no abnormal situation in the individ-

ual equipment due to the multi-process trial operation of the client and the batch acceptance after the

 large-volume purchase of the customer.

It is worth noting that Zhongwei Semiconductor is the most important component of its inventory wh-

en it issues goods. At the end of each reporting period, the book value of the goods issued by the comp-

any accounted for 38.2%, 44.63% and 47.58% of the total book value of the goods. The book value is re-

latively high, and it has increased year by year with the company's business development during the re-

porting period.

The impact of government subsidies on Zhongwei Semiconductor is the last issue of concern to the Sha-

nghai Stock Exchange. According to the reply, the number of government subsidies that Zhongwei Sem-

iconductor included in the current profit and loss during the reporting period was 110 million yuan, 110

 million yuan, and 160 million yuan respectively. Moreover, China Micro-Semiconductor obtained the sp-

ecific content of the government R&D grant to apply for exemption from disclosure.

On this basis, the reply letter also compares two companies, A-share listed company Tiandi Technology 

(600582.SH) and China Software (600536.SH), both of which will undertake national and government r-

esearch projects in the 2018 annual report. Related government grants are included in recurring gains 

and losses.

Related products:

surface mount components repair

Hot air reflow soldering machine

Motherboard repairing machine

SMD micro components solution

LED SMT rework soldering machine

IC replacement machine

BGA chip reballing machine

BGA reball

Soldering desoldering equipment

IC chip removal machine

BGA rework machine

Hot air solder machine

SMD rework station

IC remover device